TAPPI T526

This method is used to measure the resistance of coated paper and coated board to blistering in the ovens of web-fed heatset printing presses. This objective is accomplished by applying lacquer to both sides of the paper to simulate printed ink films and placing the lacquered samples in a blister tester in which both temperature and exposure time can be varied widely and reproducibly. The heat exposure simulates the action of the heatset oven. End points obtained may becompared with other test results.

Product Details

Published:

03/01/2004

Number of Pages:

6

File Size:

1 file , 280 KB