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SME MR95-164
- Resin Bond Cbn Wheels Wear Analysis Through The Chip Geometry
- standard by Society of Manufacturing Engineers, 06/01/1995
- Publisher: SME
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THIS WORK SHOWS AN EXPERIMENTAL RESEARCH ABOUT THE BEHAVIOR OF A CBN RESIN BOND WHEEL DURING A TOOL AND A HARDENED STEEL GRINDING. THE WHEEL WEAR PHENOMENA IS STUDIED WITH EMPHASIS ON BOND WEAR AND GRAIN WEAR MECHANISMS. THE EQUILIBRIUM BETWEEN BOND RETENTION FORCE AND CUTTING FORCE PER GRAIN IS STUDIED THROUGH GRINDING TESTS. THE RESULTS ANALYSIS SHOWS THAT CBN WHEEL WEAR CAN BE REDUCED, IMPROVING THE (G) RATIO, BY THE REDUCTION OF THE BOND WEAR. THIS BOND WEAR CAN BE OPTIMIZED BY CHANGING THE UNDEFORMED CHIP GEOMETRY.
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