Provide PDF Format
SME EE95-263
- Low Stress Aerobic Urethanes Lower Costs For Microelectronic Encapsulation
- standard by Society of Manufacturing Engineers, 06/01/1995
- Publisher: SME
$9.00$18.00
PIGMENTED, AS WELL AS CLEAR ENCAPSULANTS THAT CURE IN SECONDS SIGNIFICANTLY LOWER MANUFACTURING COSTS BY ELMINATING LONG BAKE CYCLES, OFF-LINE CURING AND EXTRA HANDLING. LOW MODULUS POLYMERS PROVIDE ENCAPSULATION AND UNDERFILL PROTECTION BY MINIMIZING DIFFERENTIAL STRESS ON THE DIFFERENT, YET ADJACENT MATERIALS USED IN CHIP CONSTRUCTION.
Related Products
SME ER98-306
Creating A Complete Environment For Excellence In Manufacturing Education..
$9.00 $18.00
SME IQ900435
Dimensional Precision Of Expendable Pattern, Green Sand, And No-Bake Castings..
$9.00 $18.00