Provide PDF Format
SME EE00-161
- Process Parameters Optimization For Mass Reflow 02\01 Components
- standard by Society of Manufacturing Engineers, 11/01/2000
- Publisher: SME
$9.00$18.00
The research summarized in this paper will help to address some of the issues associated with solder paste reflow assembly of 02\01 components. Attachment pad design, stencil design, component-to-component spacing, component orientation, flux type, and solder paste reflow atmosphere were the major variables researched during the project. The two major responses from the experimentation were assembly yield and assembly quality.
Related Products
SME ER98-306
Creating A Complete Environment For Excellence In Manufacturing Education..
$9.00 $18.00
SME IQ900435
Dimensional Precision Of Expendable Pattern, Green Sand, And No-Bake Castings..
$9.00 $18.00
