Provide PDF Format
JEDEC JESD22-B118
- SEMICONDUCTOR WAFER AND DIE BACKSIDE EXTERNAL VISUAL INSPECTION
- standard by JEDEC Solid State Technology Association, 03/01/2011
- Publisher: JEDEC
$30.00$59.00
This inspection method is for product semiconductor wafers and dice prior to assembly. This test method defines the requirements to execute a standardized external visual inspection and is a non-invasive and nondestructive examination that can be used for qualification, quality monitoring, and lot acceptance.
Related Products
JEDEC JESD63
STANDARD METHOD FOR CALCULATING THE ELECTROMIGRATION MODEL PARAMETERS FOR CURRENT DENSITY AND TEMPER..
$39.00 $78.00
JEDEC JEP123
GUIDELINE FOR MEASUREMENT OF ELECTRONIC PACKAGE INDUCTANCE AND CAPACITANCE MODEL PARAMETERS..
$31.00 $62.00
