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JEDEC JESD22-B106D
- RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES
- standard by JEDEC Solid State Technology Association, 04/01/2008
- Publisher: JEDEC
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This method established a standard procedure for determining whether through-hole solid state devices can withstand the effects of the temperature to which they will be subject during soldering of their leads. This revision updates the references to currently military standards.
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