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  • JEDEC JEP154
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JEDEC JEP154

  • GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS
  • standard by JEDEC Solid State Technology Association, 01/01/2008
  • Publisher: JEDEC

$38.00$76.00


This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the advantages and concerns associated with EM testing, as well as options for data analysis.

Product Details

Published:
01/01/2008
Number of Pages:
34
File Size:
1 file , 370 KB

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