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1.1 The specification covers a two-part modified epoxy paste adhesive for bonding metallic and nonmetallic materials. The adhesive should be suitable for forming bonds that can withstand environmental exposure to temperatures from -184 to 82 °C (-300 to 180°F) when exposed to an expected combination of stress, temperature, and relative humidity to be encountered in service.
Standard Practices for Force Verification of Testing Machines..
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Standard Practice for Preparation of Fire-Test-Response Standards..
Standard Specification for Copper and Copper Alloy Clad Steel Plate..
Standard Test Method for Determining the Effects of Bending a Membrane Switch or Printed Electroni..
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